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Fabrication of Submicron Feature Diffractive Elements using Near-Field Direct-Write Ultra-Violet Lithography

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Abstract

The fabrication of surface relief diffractive elements using a series of binary exposures and etches in photo-resist is attractive because it relies upon standard lithographic techniques [1]. Disadvantages of this process include the necessity for mask generation prior to photoresist exposure and the logarithmic relationship between the desired number of phase levels and number of exposures. To overcome the latter restriction, the generation of gray level masks has been proposed [2]. However, both restrictions can be overcome if the photoresist is exposed directly. Electron beam [3] and laser beam direct-write [4] procedures have been proposed. Electron beam writing is attractive for its high resolution and laser beam writing for its cost. Both high resolution and low cost are possible if a tapered fiber is used to deliver energy to the photoresist [5,6]. We report on the fabrication of diffractive gratings with submicron features using a tapered fiber to deliver ultra-violet (UV) energy to a layer of photoresist.

© 1996 Optical Society of America

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