Abstract
Integrated planar free-space optics is a viable concept for building compact systems for interconnection and sensor applications. Micro-optical elements are integrated on a single substrate to guide the light signals traveling inside the substrate [1]. Optoelectronic devices are bonded on the substrate by hybrid integration techniques such as flip-chip bonding. For interconnection applications, vertical-cavity surface emitting laser diodes (VCSELs) are of particular interest as fast 2-D input arrays.
© 1998 Optical Society of America
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