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Future advances in the application of photonic interconnects will involve the insertion of parallel-channel links into Multi-Chip Modules (MCMs) [1]. These will make use of new device-level components such as arrays of Vertical Cavity Surface Emitting Lasers (VCSEL's) [2] or arrays of Micro Cavity Light-Emitting Diodes (MCLED’s) [3] and low power photoreceiver circuits [4]. One of the challenges associated with the development of free-space intra- and inter-MCM optoelectronic interconnects is the fabrication of manufacturable, chip-compatible, and high precision monolithic micro-optical pathway blocks. These three-dimensional modules should integrate micro-optical components to optically interconnect surface-normal transmitters and receivers.
© 1998 Optical Society of America
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