Abstract
We demonstrate the single crystal diamond membrane fabrication by oxygen plasma deep etching of commercially available bulk (~300 µm thick) diamond substrate. Ion beam etching before reactive ion etching removes mechanical-polishing-induced defects, avoiding preferential etching. Re-deposition and micro-masking are mitigated by using oxidized Si carrier wafer, while preserving high etch rate (~28 µm/h).
© 2019 The Author(s)
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