Abstract

Combining the strength of multiple photonic and electronics concepts in one hybrid and multi-chip platform is a promising solution for the diversification of chips for specific computing tasks to boost performance [1]. We demonstrated flash-TPP [2], a novel CMOS compatible lithographic methodology that enables ultra-fast fabrication of high-performance 3D photonic circuits based on additive fabrication via one- (OPP) and two-photon polymerization (TPP) combined with direct-laser writing (DLW), see Fig. 1 (a).

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