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Roughness Characterization of Copper Surface in Ultraprecision Diamond Machining

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Abstract

Electroplating copper and oxygen-free copper were machined with a single-crystal diamond tool. The topographies of the machined surfaces were evaluated. The electroplating copper surface was smooth without the irregularities caused by crystal grains. © 2021 Hideo Takino, Yoshimi Takeuchi

© 2021 The Author(s)

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