Expand this Topic clickable element to expand a topic
Skip to content
Optica Publishing Group
Conferences > FiO > 2016 > FTu5B > FTu5B.3

Determining Optimized Laser Parameters for Non-Thermal Femtosecond Laser Processing of Silicon

Lauren L. Taylor and Jie Qiao

Not Accessible

Your library or personal account may give you access

Abstract

Femtosecond laser processing of silicon showed effective material removal, but with detrimental artifacts resulting from heating and oxidation. A thermal model was constructed to predict optimized processing parameters to mitigate heat accumulation.

© 2016 Optical Society of America

PDF Article
More Like This
Thermal Modeling and Heat Mitigation for Femtosecond-Laser-Based Silicon Processing

Jie Qiao, Lauren L. Taylor, and Jun Qiao
ATu3K.4 CLEO: Applications and Technology (CLEO:A&T) 2016

Comparison of Two-Temperature and Thermal Models for Prediction of the Optimal Femtosecond Laser-Material Processing of Silicon

R. E. Scott, L. L. Taylor, and J. Qiao
ATu4C.5 CLEO: Applications and Technology (CLEO:A&T) 2017

Material Removal and Thermal Impact of Femtosecond-Laser Polishing for Germanium-Based Freeform Optics

L. L. Taylor, J. C. Frechem, H. Han, J. Xu, T. R. Smith, M. Pomerantz, J. C. Lambropoulos, and J. Qiao
OTu3B.4 Optical Fabrication and Testing (OF&T) 2017

View More...
Select as filters
Select Topics Cancel
Top
       
© Copyright 2024 | Optica Publishing Group. All rights reserved, including rights for text and data mining and training of artificial technologies or similar technologies.
Privacy | Terms of Use