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Conferences > FiO > 2022 > JW5A > JW5A.50

Accessible Full-flow Electronic Photonic Packaging at the AIM Photonics TAP facility

Christopher Striemer, Graham Pennington, Jill Patel, Peter McGarvey, Colin McDonough, Barton Bergman, Annette Teng, Thomas Miller, David Harame, Tyler Howard, and Thomas Brown

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Abstract

The AIM Photonics TAP facility is a 300mm wafer compatible packaging fab available to public and private organizations for prototype development. This paper provides an overview of current packaging and metrology capabilities.

© 2022 The Author(s)

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