Abstract

For interconnection and sensor applications the use of conventional optomechanical packaging results in problems because of its bulkiness, the difficulty to achieve tight and stable alignment, and cost. Planar optics is an approach to solve the packaging problem by integrating free-space optical systems on single substrates. By using lithographic fabrication techniques for the microoptics, high alignment precision, mechanical and thermal stability are achieved. For practical applications, it is necessary to consider the influence of substrate variations like thickness tolerances and wedges between the substrate surfaces or the influence of wavelength variations on the performance of a system. In particular, it is of interest to design the optical system in such a way that it becomes insensitive to tolerances of the substrate parameters or the wavelength of the light.

© 1994 Optical Society of America