Expand this Topic clickable element to expand a topic
Skip to content
Optica Publishing Group

A Passive Alignment Technique using Au/Sn/Au Multilayer solder for LD to Fiber/Waveguide Coupling

Not Accessible

Your library or personal account may give you access

Abstract

As applications of fiber optic communications have spread from the trunk lines to the subscriber loops and LANs, requirement for low cost and small size has become severe on the key components, especially on the laser diode modules. Conventionally, totally automated active alignment, optimizing the optical axis emitting the LD , has made the LD module cost lower and lower.[1] Recently, passive alignment approaches have been challenged, to realize much lower cost, smaller size and higher density mount.

© 1994 Optical Society of America

PDF Article
More Like This
OEIC Packaging with Self-aligned Fiber to Waveguide Array Coupling by Si V-groove Flip-Chip Technique

W. Hunziker, W. Vogt, and H. Melchior
SaC3 Integrated Photonics Research (IPR) 1994

Passive alignment technique for single-channel laser diode coupling to single-mode fiber on V-grooved Si waferboard

S. Sasaki, G. Nakagawa, K. Miura, and M. Yano
WO5 Conference on Lasers and Electro-Optics/Pacific Rim (CLEO/PR) 1995

Self-aligned Tilted Amplifier Array Packaging using Si V-groove Flip-Chip Technique for Gate Array Applications

W. Hunziker, W. Vogt, H. Melchior, Ph. Brosson, P. Doussiere, T. Fillion, G. Gelly, J-L. Gentner, D. Leclerc, R. Ngo, A. Pinquier, F. Pommereau, J-G. Provost, and J-F. Vinchant
PD4 Optical Amplifiers and Their Applications (OAA) 1994

Select as filters


Select Topics Cancel
© Copyright 2024 | Optica Publishing Group. All rights reserved, including rights for text and data mining and training of artificial technologies or similar technologies.