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Optical Hybrid Integration Technology using a PLC Platform and Spot-Size Converted Devices

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Abstract

Cost reduction is a major concern in optical modules for Fiber-To-The-Home (FTTH) applications. Optical hybrid integration, where laser diodes (LDs) and/or photo-diodes (PDs) are flip-chip bonded onto a waveguide substrate, is considered as a promising way to achieve this. A V-grooved silicon has been used as a hybrid integration platform on which to assemble an LD or a PD, and a fiber[1][2]. However, there seem to be two major problems with this technology. First, the conventional silicon platform is not equipped with a waveguide, and seems to be of use only in a limited application field. Second, the coupling loss for the conventional LD to the fiber is as high as 10 dB because of its small spot- size. To achieve a low-cost optical module both the platform and the semiconductor device should be improved. This paper reviews recent progress in optical hybrid integration technology toward inexpensive optical modules.

© 1996 Optical Society of America

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