Abstract

The cost of critical alignment techniques required in the packaging of optoelectronic components has been one of the most important contributors to the high cost of these components. Recently, efforts have been undertaken around the world to develop novel techniques to reduce the complexity of alignment procedures and thereby reduce the costs of optical and optoelectronic components. Most of these aligned packaging techniques utilize platforms that while providing enhanced alignment capabilities, also allow the potential for increased hybrid integration. It is the purpose of this paper to review some of these newly evolving techniques that show particular promise or capture the imagination.

© 1996 Optical Society of America