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NEW ASSEMBLY TECHNOLOGY FOR SMALL SURFACE MOUNT LEDS.

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Abstract

The Optoelectronics Division of Hewlett-Packard has developed a new technology for making surface mount L.E.D lamps and indicators whereby the internal wire bond is eliminated. The new technology clears the way for products with enhanced reliability while offering a path to fast and inexpensive proliferations. That will enable OED to increase its range of products in a fast growing market.

© 1996 Optical Society of America

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