Pick-and-place multi-wafer bonding of photonic devices on Si

D. Crouse; Z. H. Zhu; Y. H. Lo; H. Hou

Integrated Photonics Research
OSA Technical Digest (Optica Publishing Group, 1998),
paper IMF4

Pick-and-place multi-wafer bonding of photonic devices on Si

D. Crouse, Z. H. Zhu, Y. H. Lo, and H. Hou

Integrated Photonics Research 1998

British Columbia Canada
ISBN: 1-55752-521-8

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Novel Fabrication Techniques (IMF)

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D. Crouse, Z. H. Zhu, Y. H. Lo, and H. Hou, "Pick-and-place multi-wafer bonding of photonic devices on Si," in Integrated Photonics Research, Vol. 4 of OSA Technical Digest (Optica Publishing Group, 1998), paper IMF4.

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Abstract

There has recently been great strides in device integration using wafer bonding.

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