Uncooled and low cost plastic package for high bit rate applications.

Jean-Louis Nicque

doi:10.1364/IPR.1999.RWD1

Integrated Photonics Research
OSA Technical Digest Series (Optica Publishing Group, 1999),
paper RWD1
•https://doi.org/10.1364/IPR.1999.RWD1

Uncooled and low cost plastic package for high bit rate applications.

Jean-Louis Nicque

Integrated Photonics Research 1999

Santa Barbara, California United States
ISBN: 1-55752-586-2

From the session
Integrated Devices (RWD)

Not Accessible

Your library or personal account may give you access

Get PDF
Email
Share
Get Citation
Copy Citation Text
J. Nicque, "Uncooled and low cost plastic package for high bit rate applications.," in Integrated Photonics Research, OSA Technical Digest Series (Optica Publishing Group, 1999), paper RWD1.

Export Citation
- BibTex
- Endnote (RIS)
- HTML
- Plain Text
Citation alert
Save article

Abstract

Telecommunications is an exponentially growing market for long distance transmission, metropolitan links and local access services.

PDF Article

More Like This

High-performance and low-cost plastic optical modules for the access network applications

K. Tatsuno, T. Kato, T. Hirataka, K. Yoshida, T. Ishii, T. Kono, T. Miura, R. Sudo, and M. Shimaoka
WB3 Optical Fiber Communication Conference (OFC) 1997

LASER DIODE PACKAGE ASSEMBLY FOR LOW COST AND FOR HIGH PERFORMANCE APPLICATIONS

T.S. Stakeion, M. Dixon, and G.M. Chaoui
SaA2 Integrated Photonics Research (IPR) 1994

Low-cost compact WDM components for LAN applications

Brian E. Lemoff, Lewis B. Aronson, and Lisa A. Buckman
TuH1 Optical Fiber Communication Conference (OFC) 1999

Previous Article Next Article