Passive alignment technologies for O/E components packaging

E. Grard; S. Kerboeuf

doi:10.1364/IPR.2001.ITuC3

Integrated Photonics Research
OSA Trends in Optics and Photonics Series (Optica Publishing Group, 2001),
paper ITuC3
•https://doi.org/10.1364/IPR.2001.ITuC3

Passive alignment technologies for O/E components packaging

E. Grard and S. Kerboeuf

Integrated Photonics Research 2001

Monterey, California United States
ISBN: 1-55752-673-7

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Integrated Lasers and Amplifiers Special Symposium (ITuA)

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E. Grard and S. Kerboeuf, "Passive alignment technologies for O/E components packaging," in Integrated Photonics Research, A. Sawchuk, ed., Vol. 58 of OSA Trends in Optics and Photonics Series (Optica Publishing Group, 2001), paper ITuC3.

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Abstract

A generic passive assembly process for low cost emitter and photorereceiver modules is described. Main results are presented in term of performances and robustness. Potentiality of this new technology for more complex & higher functionality OE modules are highlighted.

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