Expand this Topic clickable element to expand a topic
Skip to content
Optica Publishing Group
Conferences > IPRA > 2006 > ITuD > ITuD2

Thermal Characteristics of Thin Film VCSELs for Fully Embedded Chip-to-Chip Guided-Wave Optical Interconnection

Jinho Choi and Ray T. Chen

Not Accessible

Your library or personal account may give you access

Abstract

The thermal characteristics of a thin film VCSEL are studied both theoretically and experimentally. The theoretical analysis of thermal via effects is performed to determine optimized thickness range of VCSEL for the fully embedded structure.

© 2006 Optical Society of America

PDF Article
More Like This
Chip-to-chip optical interconnects

J. A. Kash, F. E. Doany, L. Schares, C. L. Schow, C. Schuster, D. M. Kuchta, P. K. Pepeljugoski, J. M. Trewhella, C. W. Baks, R. A. John, L. Shan, Y. H. Kwark, R. A. Budd, P. Chiniwalla, F. R. Libsch, J. Rosner, C. K. Tsang, C. S. Patel, J. D. Schaub, D. Kucharski, D. Guckenberger, S. Hegde, H. Nyikal, R. Dangel, F. Horst, B. J. Offrein, C. K. Lin, A. Tandon, G. R. Trott, M. Nystrom, et al.
OFA3 Optical Fiber Communication Conference (OFC) 2006

Finite Difference Analysis of Thermal Characteristics of Continuous Wave Operation 850 nm Lateral Current Injection and Implant-apertured VCSEL with Flip-chip Bond Design

R. Mehandru, G. Dang, B. Luo, S. Kim, F. Ren, S. J. Pearton, W. S. Hobson, J. Lopata, M. Tayahi, W. Chang, and H. Shen
CThA2 Conference on Lasers and Electro-Optics (CLEO:S&I) 2002

25-Gbps operation of 1.1-μm-range InGaAs VCSELs for high-speed optical interconnections

N. Suzuki, H. Hatakeyama, K. Fukatsu, T. Anan, K. Yashiki, and M. Tsuji
OFA4 Optical Fiber Communication Conference (OFC) 2006

View More...
Select as filters
Select Topics Cancel
Top
       
© Copyright 2024 | Optica Publishing Group. All rights reserved, including rights for text and data mining and training of artificial technologies or similar technologies.
Privacy | Terms of Use