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Fluxless Flip-Chip Bonding of Single Photodetector Chips Using Laser-Induced Forward Transfer

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Abstract

We demonstrate the successful flip-chip bonding and DC characterization of commercial photodiode chips via micro-bumps of indium and silver nano-particle (AgNP) based inks, printed using the Laser-Induced Forward Transfer (LIFT) technique.

© 2014 Optical Society of America

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