Abstract

As we have previously reported [1,2], the frequency-doubled copper vapour laser (uv-CVL) can be used to micro-machine structures of identical quality to those produced by excimer laser ablation. Due to the much greater pulse repetition rate (prf) of the uv-CVL, material removal rates can be many times higher than those obtainable with excimer lasers. As the 255 nm wavelength of the uv-CVL is very close to that of the KrF excimer laser (248 nm), this also provides an opportunity to study the contributions of photochemical and photothermal effects to the ablation process due to the difference in the energy delivery characteristics between the two lasers - high prf and moderate pulse energy from the uv-CVL compared with low prf and high pulse energy from excimer lasers.

© 1996 Optical Society of America