Hyperspectral imaging system for evaluating the stress field in digital photoelasticity

Juan Briñez-de León; Hermes Fandiño-Toro; Hermes Fandiño-Toro; María Torres-Madroñero; Alejandro Restrepo-Martínez

doi:10.1364/ISA.2021.IW6D.6

OSA Imaging and Applied Optics Congress 2021 (3D, COSI, DH, ISA, pcAOP)
OSA Technical Digest (Optica Publishing Group, 2021),
paper IW6D.6
•https://doi.org/10.1364/ISA.2021.IW6D.6

Hyperspectral imaging system for evaluating the stress field in digital photoelasticity

Juan Briñez-de León, Hermes Fandiño-Toro, María Torres-Madroñero, and Alejandro Restrepo-Martínez

Imaging Systems and Applications 2021

Washington, DC United States
19–23 July 2021
ISBN: 978-1-943580-89-7

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High-throughput/Multi-spectral Imaging (IW6D)

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J. B. León, H. Fandiño-Toro, M. Torres-Madroñero, and A. Restrepo-Martínez, "Hyperspectral imaging system for evaluating the stress field in digital photoelasticity," in OSA Imaging and Applied Optics Congress 2021 (3D, COSI, DH, ISA, pcAOP), H. Hua, B. Javidi, M. Martinez-Corral, O. Matoba, A. Stern, S. Thibault, T. Alieva, J. Ke, F. Willomitzer, F. Okten, P. Silveira, P. Banerjee, E. Stoykova, D. Chu, J. Park, F. Imai, C. Joo, M. Digman, D. Gardner, S. Gladysz, D. LeMaster, S. Basu, and O. Korotkova, eds., OSA Technical Digest (Optica Publishing Group, 2021), paper IW6D.6.

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Abstract

A limitation for developing real-time stress evaluation in digital photoelas- ticity relies on the multiple acquisitions required and complicated algorithms for fringe demodulation. This paper proposes a hyper-spectral imaging system as a solution of such drawbacks.

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