Thermal Crosstalk Evaluation of Densely Packed 1.1 μm-band VCSEL Array for Multi-core Fiber Transmission

Liang Dong; Xiaodong Gu; Fumio Koyama

doi:10.1364/JSAP.2021.10a_N405_8

JSAP-OSA Joint Symposia 2021 Abstracts
OSA Technical Digest (Optica Publishing Group, 2021),
paper 10a_N405_8
•https://doi.org/10.1364/JSAP.2021.10a_N405_8

Thermal Crosstalk Evaluation of Densely Packed 1.1 μm-band VCSEL Array for Multi-core Fiber Transmission

Liang Dong, Xiaodong Gu, and Fumio Koyama

JSAP-OSA Joint Symposia 2021

Nagoya Japan
26–26 August 2021
ISBN: 978-4-86348-785-7

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Photonics Devices, Photonic Integrated Circuit and Silicon Photonics (PDPIC)

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L. Dong, X. Gu, and F. Koyama, "Thermal Crosstalk Evaluation of Densely Packed 1.1 μm-band VCSEL Array for Multi-core Fiber Transmission," in JSAP-OSA Joint Symposia 2021 Abstracts, OSA Technical Digest (Optica Publishing Group, 2021), paper 10a_N405_8.

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Abstract

Edge data centers (EDCs) have been attracting much attention due to the rapid growth of big data, the Internet of Things (IoT) and 5G mobile networking.

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