Ultrafast-Laser-Enabled Microwelding and Waveguide Inscription for Optics and Laser Fabrication

J. Qiao; J. Qiao; T. Feng; T. Feng; P. K. Sahoo; S. Patra; R. Haque; C. Dorrer

doi:10.1364/LAC.2020.LW1B.5

Laser Congress 2020 (ASSL, LAC)
OSA Technical Digest (Optica Publishing Group, 2020),
paper LW1B.5
•https://doi.org/10.1364/LAC.2020.LW1B.5

Ultrafast-Laser-Enabled Microwelding and Waveguide Inscription for Optics and Laser Fabrication

J. Qiao, T. Feng, P. K. Sahoo, S. Patra, R. Haque, and C. Dorrer

Laser Applications Conference 2020

Washington, D.C. United States
13–16 October 2020
ISBN: 978-1-943580-84-2

From the session
Brittle Material Processing (LW1B)

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J. Qiao, T. Feng, P. K. Sahoo, S. Patra, R. Haque, and C. Dorrer, "Ultrafast-Laser-Enabled Microwelding and Waveguide Inscription for Optics and Laser Fabrication," in Laser Congress 2020 (ASSL, LAC), P. Schunemann, C. Saraceno, S. Mirov, S. Taccheo, J. Nilsson, A. Petersen, D. Mordaunt, and J. Trbola, eds., OSA Technical Digest (Optica Publishing Group, 2020), paper LW1B.5.

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Abstract

A dynamic pulse propagation modeling for femtosecond laser bonding of transparent materials is developed, accurately predicting temperature evolution and internal modifications. Waveguide lasers inscribed by a femtosecond laser are demonstrated.

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