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Conferences > LS > 2014 > JW3A > JW3A.9

Subsurface Damage Characterization with Nonlinear High Numerical Microscopy

Phat Lu, Youngsik Kim, and Tom D. Milster

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Abstract

Sub-surface damage characterization occurs in semiconductor device fabrication, like diamond turning and milling. Third harmonic generation (THG) microscopy can help to characterize subsurface damage, because nanometer sized asperities caused by defects amplify the THG signal.

© 2014 Optical Society of America

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