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Intra-board Free-space Optical Interconnects for Data Centers

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Abstract

We present chip-to-chip, free-space optical interconnect as solderable SMD component, “LightKonnect™”, for co-packaged optics. LightKonnect communicates between processors over free space avoiding expensive alignment. Free space communication between processors enables compact low power data centers.

© 2022 The Author(s)

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