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Industrial micromachining with ultrafast laser: ps and fs comparison on metals and semiconductors

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Abstract

Pico and femtosecond lasers present a growing interest for industrials applications such as sur-face structuring or thin film selective ablation. Indeed, they combine the unique capacity to process any type of material (dielectrics, semiconductors, metals) with an outstanding precision and a reduced affected zone. We report on results about surface engraving of metals, semiconductor and polymer using a picosecond thin disk Yb: YAG-amplifier offering both CPA and CPA-free modes, a Yb-doped crystal based laser, and a fiber laser. The volume ablation rate can be maximized with an optimum setting of the laser parameters. The value of this maximum depends on the threshold fluence and the energy penetration depth. Both measures themselves depend on the pulse duration. For metals the dependence of the threshold fluence is well known, it stays almost constant for pulse durations up to about 10 ps and begin then to slightly increase with the pulse duration. The contrary behavior is observed for the energy penetration depth, it decreases over the whole range when the pulse duration is raised from 500 fs to 50 ps. In this paper we will show that the maximum ablation rate can therefore be increased by a factor of 1.5 to 2 when the pulse duration is reduced from 10 ps down to 500 fs.

© 2012 Optical Society of America

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