Abstract

Direct materials processing by focused particle beams has received considerable attention in recent years. The electron beam, traditionally used for resist exposure in electron beam lithography applications, is among the candidates for direct materials modification. High energy electrons (>1keV) are not very chemically active due to small cross sections for inelastic scattering processes such as bond dissociation and attachment. Low energy electrons are expected to be much more efficient at stimulating chemical processes. In particular, secondary electrons produced by particle or photon bombardment of surfaces with kinetic energies of approx. 2-10 eV have large cross sections for attachment and dissociative electron attachment to many electronegative molecules. We have begun a general investigation of chemical reactivity and mechanisms of electron-adsorbate interactions leading to film growth and deposition. Prospects for applications to focussed beam, direct write materials processing are being explored.

© 1987 Optical Society of America