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Thermally Stable NLO Polymers Based on Thermal Crosslinking

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Abstract

The relaxation of the dipole alignment over time and particularly at elevated temperatures of electric field poled second order NLO organic materials is one of the problems facing this technology. The limited temperature range makes it difficult to process the material into devices and difficult to package the devices into circuits. The prospects for hybrid circuits of combined semiconductor and organic devices on semiconductor substrates are promising but will require organic materials with improved thermal stability.

© 1992 Optical Society of America

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