Author Affiliations

Hongyan Mei,¹ Jad Salman,¹ Boyang Zhao,² Graham Joe,¹ Shanyuan Niu,² Huan Zhao,³ Yucheng Zhou,² Thomas Orvis,² Huaixun Huyan,² Jiangbin Wu,³ Yang Liu,² Han Wang,³ Jayakanth Ravichandran,^2,3 and Mikhail A. Kats^1,4,5,*

¹Department of Electrical and Computer Engineering, University of Wisconsin-Madison, Madison, Wisconsin 53706, USA

²Mork Family Department of Chemical Engineering and Materials Science, University of Southern California, Los Angeles, CA, USA

³Ming Hsieh Department of Electrical Engineering, University of Southern California, Los Angeles, CA, USA

⁴Department of Materials Science and Engineering, University of Wisconsin-Madison, Madison, Wisconsin 53706, USA

⁵Department of Physics, University of Wisconsin-Madison, Madison, Wisconsin 53706, USA

^*Corresponding author: mkats@wisc.edu