Abstract

The continual reduction of printable feature sizes in micro-electronics fabrication will require UV optics and possibly x-ray or ebeam lithography in the coming decade. Since circuit patterns are typically adversely affected by particles one tenth of the minimum feature size, optical particle detection will be required to operate well into the Rayleigh limit, where the scattered light intensities fall as the sixth power of diameter for isolated particles. The resulting marked drop in signal level, plus the need for shorter times between technology introductions and volume manufacturing, leads to a segmentation of sensor technologies into a spectrum of niches ranging from off-line (slow, highly sensitive lab tools) to on-line (stand-alone product inspection on the manufacturing floor) to in-line (in the process flow) to in-situ (in the process chambers). We will outline the required speed and sensitivities for different particulate detection applications over the next ten years.

© 1990 Optical Society of America