Abstract

High-peak power short-wavelength excimer laser radiation has been used for a range of applications. Excimer laser direct write marking and micromachining has become a powerful technique for many important applications. In general, excimer laser processing is divided into three categories: (1) Image marking/micromachining, (2) Surface mask scanning, and (3) Direct write marking/ micromachining. Image marking is a simple method. A pre-designed mask is used to image the laser beam onto the work surface. Image processing is straightforward and a relatively large area can be marked simultaneously. However, the mask and tooling time can be costly. Direct write processing overcomes these difficulties. It uses an imaged laser spot as a pencil tip which is moved across the sample with circular interpolation using a CAD/CAM postprocessor. Advantages of direct write processing are that it reduces localized heating by fast scanning and it is more flexible. It also allows the pulse energy, high repetition rate lasers to be used very effectively. When properly implemented, it also permits high Beam Utilization Factor for small beam energy lasers. Results from this direct write processing of various materials and beam delivery techniques will be reported.

© 1990 Optical Society of America