Abstract

Until now lithography equipment has focused on IC fabrication with a current startup cost for a wafer fab estimated at $200M, nearly a tenfold increase over the past decade. The reasons for this escalation are rooted in our approach to equipment development which focuses the majority of resources to leading edge technology, leaving used and outmoded equipment to late entries into the industry. An alternative approach to optical lithography tooling is presented that avoids the high cost of startups and is therefore more attractive to the global community. A steeper tool is required that features enhanced flexibility of the substrate and mask formats, greatly improved ruggedness and environmental immunity, and precise but simple control of metrology. New mask making techniques and strategies are needed which can leverage the current high cost of electron-beam mask fabrication and drastically reduce the requirements for mask inspection and repair. New techniques in product inspection and control of critical dimensions and overlay are needed to eliminate the routine use of expensive electron microscopes, defect inspection, and x/y measuring tools.

© 1991 Optical Society of America