Abstract

The development of a range of subcomponents and a common integration technology for preparing InP based OEICs for subscriber access systems is described. The development of suitable packaging techniques for incorporating these devices in transceiver modules is also discussed. OEICs are seen as an advantageous route for achieving the type of high functionality devices that are required in these systems, offering the potential of low cost and high reliability. Device functionalities include lasers, waveguides, broad and narrow band WDM, power monitoring, and signal detection. To this end, we have prepared OEICs incorporating DFB and DBR lasers, waveguides, process tolerant couplers, wavelength duplexers, add-drop narrow band WDM components, optical filters, and monitor diodes. Laser-waveguide integration is achieved by a butt coupled approach using low pressure MOVPE. The process is designed to be high yielding and is suitable for high volume OEIC fabrication in future manufacture. OEICs so far developed include those incorporating lasers with wavelength duplexers for 1300/1530 nm bidirectional links, lasers with wavelength duplexers and an additional coupler for bidirectional telephony (1300 nm) and broadband (1530 nm) services, and lasers with narrow band WDM components providing add-drop optical multiplexing facilities.

© 1992 Optical Society of America