Abstract

Highly integrated optical interconnect networks offer performance gains in electronic systems, but to be used by system manufacturers, the optical technology must be stable at the high temperatures experienced by electronic systems during operation and assembly. To address this requirement, we have developed polyimide-based guest/host materials that have good electro-optic performance and are stable at high temperatures. One promising material consists of Hitachi LQ-2200 as the polyimide host and the laser dye DCM as the guest. This material has been used to fabricate integrated optic devices on silicon substrates, spin-coating the polyimide waveguide layers, defining channel waveguides by photobleaching, and poling at fields as high as 250 V/μm.

© 1992 Optical Society of America