Abstract

A new concept of optic interconnects for multi-chip modules (MCMs) is proposed based on all-silicon integration of CMOS IC with single-mode integrated waveguides. This new concept, based on light distributed interconnect active (LIDIA) optoelectronic substrates, provides chip-to-chip direct communication within 0.35 μm VLSI/ULSI CMOS MCMs. In order to avoid direct integration of GaAs light sources into silicon circuitry, the CW laser diode array is located outside the MCM. The interconnect transceivers are composed of E-O external modulators and silicon photodetectors. The presented architecture requires only minor modification of silicon CMOS circuitry. In this communication, we analyze system design and technological bottlenecks of the optoelectronic MCMs based on CW LD array, single-mode channel waveguides, plasmon E-O modulators, Si photodetectors, and 0.35 μm CMOS MCMs.

© 1992 Optical Society of America