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Multiwavelength substrate interconnects for demultiplexing applications

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Abstract

Single wavelength fanout and multi-wavelength WDM components are important in optical fiber communication links and wafer scale integrated (WSI) systems for optical interconnection and networking. The use of transparent substrates as beam propagation and interconnection media for such devices are attractive owing to the dimensional freedom and compact packaging the substrates offer. Substrate fanout1,2 and WDM3 optical interconnects based on 2-D holographic diffraction have been reported. However, in some planar-integrated transceiver and networking applications 3-D diffraction based devices may be required to achieve the planar fanout and WDM interconnects. Herein, we report on the realization of a substrate WDM device following our previous work on substrate fanout and simplified holographic 3-D diffraction theory.4

© 1993 Optical Society of America

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