Abstract

It is now widely recognized that free-space optical interconnects can be effectively used for implementing fast parallel computing and communication switching systems only if high speed smart pixels can be made available, manufactured and packaged at low cost. At UCSD, using flip-chip bonding, various devices combining logic circuits and light detectors on silicon with light modulators on Lead Lanthanum Zirconate Titanate (PLZT) (for phase modulation), and on III-V Multiple Quantum Wells (MQW) (for absorption modulation) have been investigated.

© 1993 Optical Society of America