Abstract

Anticipation of large scale integration of vertical cavity surface emitting laser (VCSEL) and receiver arrays with CMOS processing circuits is driving the investigation of optical interconnects to find a strategy suitable to deliver this high throughput technology and yet acceptable to conventional electronics system designers who are unfamiliar and perhaps uncomfortable with conventional optics. A short list of desirable system attributes would include: densely packed optical channels, inexpensive and compact packaging, and optomechanical systems without critical micron level alignment tolerances.

© 1997 Optical Society of America