Abstract

Providing an integrated packaging solution for a two-dimensional smart pixel array presents a series of constraints that complicate the employment of standard electronic packaging in systems applications. Through the construction of demonstrator systems, the Photonic Systems Group at McGill University (PSG McGill) has designed, fabricated, and implemented smart pixel array packaging which uniquely addresses the critical issues associated with successfully integrating two-dimensional optoelectronic device arrays into systems. These system design considerations are: electrical bandwidth, electrical connectivity, thermal management, and optomechanical interfacing.

© 1997 Optical Society of America