Design and Packaging of a Vertical Free-Space Opto-electronic Interconnect System

Xuezhe Zheng; Philippe J. Marchand; Dawei Huang; Osman Kibar; Nur Ozkan; Sadik Esener

doi:10.1364/OC.1999.OThA3

Optics in Computing
OSA Technical Digest (Optica Publishing Group, 1999),
paper OThA3
•https://doi.org/10.1364/OC.1999.OThA3

Design and Packaging of a Vertical Free-Space Opto-electronic Interconnect System

Xuezhe Zheng, Philippe J. Marchand, Dawei Huang, Osman Kibar, Nur Ozkan, and Sadik Esener

Optics in Computing 1999

Aspen, Colorado United States
ISBN: 1-55752-584-6

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X. Zheng, P. J. Marchand, D. Huang, O. Kibar, N. Ozkan, and S. Esener, "Design and Packaging of a Vertical Free-Space Opto-electronic Interconnect System," in Optics in Computing, OSA Technical Digest (Optica Publishing Group, 1999), paper OThA3.

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Abstract

The performance requirements of computer, telecommunication, and data-communication systems have increased considerably in recent years to the point that large-scale electronic systems are suffering from an interconnection bottleneck.

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