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Modular System Demonstrator for Hybrid VCSEL/MSM Smart Pixel Networking

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Abstract

We describe a high throughput photonic network system that transfers three-dimensional optical data packets among nodes using a hybrid modular combination of CMOS circuitry with smart-pixel VCSEL-MSM (Vertical Cavity Surface Emitting Laser-Metal-Semiconductor-Metal) optoelectronic (OE) chips for input-output.

© 1999 Optical Society of America

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