Abstract
This paper describes the design features and performance of a circuit pack to backplane multifiber optical connector capable of interconnecting up to 18 fibers through the backplane of an electronic hardware packaging system. Although designed for the AT&T FASTECH™1 system, it is compatible with other backplane type systems. The connector uses precision etched V-groove silicon chips to mass terminate the fibers. The fibers are epoxy bonded between two chips; this forms a rectangular assembly called an array. This proven epoxy bonded chip technology is used by AT&T for splicing both multimode and single mode ribbon fiber.
© 1986 Optical Society of America
PDF ArticleMore Like This
S. NAGASAWA, T. SATAKE, I. SANKAWA, and R. ARIOKA
WK2 Optical Fiber Communication Conference (OFC) 1986
Maddalena Ferrario, Domenico Coviello, Pierpaolo Boffi, Vito Basile, Irene Fassi, Matteo Falcucci, Chiara Renghini, and Mario Martinelli
Th2A.56 Optical Fiber Communication Conference (OFC) 2016
Allen H. Cherin and Philip J. Rich
WA7 Optical Fiber Transmission (OFC) 1977