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High-functionality waveguide/MSM/HEMT integrated receiver prepared by one-step OMCVD growth on patterned InP substrates

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Abstract

Future lightwave systems will require both photonic integrated circuit (PIC) components that integrate a variety of optical devices and optoelectronic integrated circuit (OEIC) components that interface optical devices with high-performance electronic devices. In the past few years there was been considerable effort in these two directions aimed at (1) increasing integration complexity toward great functionality and (2) incorporating advanced devices to achieve enhanced performance.

© 1991 Optical Society of America

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