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Passive coupling of an InGaAsP/InP laser array and single-mode fibers with silicon waferboard

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Abstract

Optical fiber systems with a large number of parallel channels, such as those needed for fiber distribution to the home and computer interconnects, require the integration of many optoelectronic devices, fibers, and electronic circuits. Cost is the most significant issue in determining the feasibility of these systems. Packaging is the dominant cost for optoelectronic components, particularly in the case of diode lasers, which require active alignment of a fiber pigtail.

© 1991 Optical Society of America

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