Abstract

Integrated laser-diode arrays (ILDAs) are considered as potential compact light sources used in system applications, such as in a wavelength-division-multiplexing system to increase the transmission capacity or in a computer networking system for parallel data transport.^1,2 Optoelectronic packaging is an important consideration for ILDAs to be successfully used in such applications.³ From the viewpoint of packaging, the ILDAs should possess the following properties: From the electrical standpoint, there should be little or no power penalty incurred by cross talk at high speeds; from the optical standpoint, coupling efficiency should be high, misalignment tolerance should be large, and coupling optics should be used as little as possible.

© 1995 Optical Society of America