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Optica Publishing Group
  • Optical Fiber Communication Conference
  • 1998 OSA Technical Digest Series (Optica Publishing Group, 1998),
  • paper ThS4

Packaging of optoelectronic devices with high coupling efficiency using silicon V-groove technology

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Abstract

Volume manufacturing of optical devices using the silicon V-groove (or silicon motherboard) technology is now well established.1

© 1998 Optical Society of America

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