Abstract

Demands for large capacity transmission services necessitate high-speed optical interconnections. It is also crucial to develop reliable and compact packaging technologies to utilize the potential of opto-electronic devices involved. “Ultra High-Density Electronics System Integration R&D Project” is the consortium of a government-industry-university collaboration supported by the New Energy and Industrial Technology Development Organization (NEDO) and started in Sep- tember 1999 by the Association of Super-Advanced Electronics Technologies (ASET).¹ It is one of the project goals to realize new opto-electronic packaging technologies at an intra-cabinet level with the transmission throughput of more than Tbps (terabit/sec). To increase the interconnection bandwidth, wavelength division multiplexing (WDM) is an important technology. However, dense WDM used in long-distance telecommunication is not suitable for the intra-cabinet-level interconnections due to its system complexity and inevitable high production cost. Instead, we chose wide-channel-spacing wavelength division multiplexing (WWDM)² since it is expected to reduce fabrication cost by allowing uncooled lasers and simpler wavelength multiplexing devices than DWDM scheme. To realize WWDM systems, wavelength multiplexing and demultiplexing devices are key components.

© 2002 Optical Society of America