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Optical Through-Hole With High Aspect Ratio for On-Board Optical Transmission

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Abstract

We developed optical I/Os in packages for chip-to-chip interconnections. The I/Os of 55-µm-diameter and 1.2-mm-long optical through-holes demonstrate low loss and 10-Gb/s transmission. This package aims at future CPU systems with embedded capacitors.

© 2011 Optical Society of America

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