Planar Fiber Packaging Method for Silicon Photonic Integrated Circuits

Bradley Snyder; Peter O’Brien

doi:10.1364/OFC.2012.OM2E.5

Optical Fiber Communication Conference
OSA Technical Digest (Optica Publishing Group, 2012),
paper OM2E.5
•https://doi.org/10.1364/OFC.2012.OM2E.5

Planar Fiber Packaging Method for Silicon Photonic Integrated Circuits

Bradley Snyder and Peter O’Brien

Optical Fiber Communication Conference 2012

Los Angeles, California United States
4–8 March 2012
ISBN: 978-1-55752-938-1

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Silicon Photonics I (OM2E)

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B. Snyder and P. O’Brien, "Planar Fiber Packaging Method for Silicon Photonic Integrated Circuits," in Optical Fiber Communication Conference, OSA Technical Digest (Optica Publishing Group, 2012), paper OM2E.5.

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Abstract

A novel method for fiber packaging silicon waveguides is presented. The process uses angled fibers and capillary action of UV-cure epoxy. The technique is suited to passive alignment and can be scaled for fiber arrays.

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