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Conferences > OFC > 2012 > OM3E > OM3E.4

Low Temperature Wafer Bonding of Silicon to InP and Silicon to LiNbO3 Using Self-Assembled Monolayers

V. Artel, I. Bakish, T. Kraus, M. Shubely, Y. Ben-Ezra, E. Shekel, S. Zach, A. Zadok, and C. N. Sukenik

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Abstract

Procedures for wafer bonding between silicon and InP and between silicon and LiNbO3 at temperatures below 120 °C are reported. The bonding is based on the deposition of functionalized, organic self assembled monolayers.

© 2012 Optical Society of America

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