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Conferences > OFC > 2013 > OM2J > OM2J.6
  • Optical Fiber Communication Conference/National Fiber Optic Engineers Conference 2013
  • OSA Technical Digest (online) (Optica Publishing Group, 2013),
  • paper OM2J.6
  • •https://doi.org/10.1364/OFC.2013.OM2J.6

High Density Optical Interconnects Integrated with Lasers, Optical Modulators and Photodetectors on a Single Silicon Chip

Yutaka Urino, Tsuyoshi Horikawa, Takahiro Nakamura, and Yasuhiko Arakawa

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Abstract

Silicon optical interposers for inter-chip interconnects, integrated with lasers, an optical splitter, optical modulators and germanium photodetectors on a single silicon substrate were demonstrated. A 12.5-Gbps error-free data transmission and 6.6-Tbps/cm2 transmission density were achieved.

© 2013 Optical Society of America

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